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integrated-application package

См. также в других словарях:

  • Package on package — (PoP) is an integrated circuit packaging technique to allow vertically combining discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed on top of one another, i.e. stacked, with a standard interface to route… …   Wikipedia

  • integrated software —    Application software that combines the functions of several major applications, such as a spreadsheet, a database, a word processor, and a communications program, into a single package. Microsoft Works is an example of integrated software.… …   Dictionary of networking

  • Integrated circuit — Silicon chip redirects here. For the electronics magazine, see Silicon Chip. Integrated circuit from an EPROM memory microchip showing the memory blocks, the supporting circuitry and the fine silver wires which connect the integrated circuit die… …   Wikipedia

  • integrated circuit — Electronics. a circuit of transistors, resistors, and capacitors constructed on a single semiconductor wafer or chip, in which the components are interconnected to perform a given function. Abbr.: IC Also called microcircuit. [1955 60] * * * ▪… …   Universalium

  • Package management system — A package management system is a collection of tools to automate the process of installing, upgrading, configuring, and removing software packages from a computer. Linux and other Unix like systems typically manage thousands of discrete… …   Wikipedia

  • package — {{Roman}}I.{{/Roman}} noun 1 (esp. AmE) something wrapped in paper, etc. ⇨ See also ↑parcel ADJECTIVE ▪ big, bulky, compact, neat, small ▪ wrapped ▪ …   Collocations dictionary

  • Integrated Circuit — Circuit intégré Pour les articles homonymes, voir CI. Le circuit intégré (CI), aussi appelé puce électronique, est un composant électronique reproduisant une ou plusieurs fonctions électroniques plus ou moins complexes, intégrant souvent… …   Wikipédia en Français

  • electronic substrate and package ceramics — Introduction       advanced industrial materials that, owing to their insulating qualities, are useful in the production of electronic components.       Modern electronics are based on the integrated circuit, an assembly of millions of… …   Universalium

  • Three-dimensional integrated circuit — In electronics, a three dimensional integrated circuit (3D IC, 3D IC, or 3 D IC) is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The semiconductor… …   Wikipedia

  • Mobile application development — is the process by which application software is developed for small low power handheld devices such as personal digital assistants, enterprise digital assistants or mobile phones. These applications are either pre installed on phones during… …   Wikipedia

  • ISO 10303 Application Modules — The STEP Application modules define common building blocks to create modular Application Protocols (AP) within ISO 10303. Higher level modules are built up from lower level modules. The modules on the lowest level are wrappers of concepts,… …   Wikipedia

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